In sputter deposition processes, the thickness distribution of the film is affected by experimental conditions such as gas pressure, target-substrate (T-S) distance and target elements. To study these effects, we have designed a sample holder with...
The mode transition of the DC reactive sputter deposition process has been studied for the fabrication and the stoichiometry control of SiOX films. At a fixed Ar flow rate of 20 sccm and a pressure of 1 Pa (hence the pumping speed was also fixed),...
T Nakano   H Mizuhashi   S Baba   
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 44(4A) 1932-1938 2005年4月 [査読有り]
The evolution of the surface morphology of Cu-In alloy film has been studied using an atomic force microscope. Samples of Cu-In were prepared by sequential vacuum deposition: copper was deposited to 10-40nm thick first on a glass substrate, follow...
The island structure of indium has been investigated by employing the depth profile measurement of XPS. Indium films of 30∼180 nm (in mass thickness) were deposited on silicon substrate by vacuum evaporation at 80°C. The island structure was confi...
T Nakano   K Tanaka   S Baba   
VACUUM 74(3-4) 387-390 2004年6月 [査読有り]
Optical emission from axisymmetric copper-sputter deposition plasma has been measured in a spatially resolved way, and the radial distribution profiles are obtained using a computed tomography technique. Among the emission spectrum two strong copp...
High power pulsed magnetron sputtering (HPPMS) is a variant of sputtering deposition method in that pulsed power is applied to the sputtering target with low repetition frequency and small duty ratio. It produces high density plasma intermittently...