T Nakano   S Sato   S Baba   
VACUUM 74(3-4) 591-594 2004年6月 [査読有り]
The structural changes of sequentially evaporated thin Cu-In films on molybdenum substrate were studied by the depth profiling technique in an XPS apparatus. Pure metal materials were deposited by vacuum evaporation at room temperature. A specimen...
T Nakano   T Fujimoto   S Baba   
VACUUM 74(3-4) 595-599 2004年6月 [査読有り]
Magnesium oxide (MgO) films were prepared by RF sputter deposition technique, and their secondary electron emission (SEE) coefficient was examined in relation to film thickness and surface morphology. The optical constant and film thickness were e...
The copper atomic density within the sputter plasma and its dependence on Target-Substrate (T-S) distance has been investigated using the optical emission spectroscopy (OES). It has been understood that the atomic density of copper can be evaluate...
Scaling analysis of the surface roughness has been performed on copper films prepared by DC magnetron sputter deposition. The deposition was performed at Ar gas pressures of 2 and 10 Pa. Under both pressures, deposition rates were almost the same ...
T Nakano   N Ohnuki   S Baba   
VACUUM 59(2-3) 581-585 2000年11月 [査読有り]
Optical emission spectroscopy (OES) with a wavelength range of 185-525 nm has been performed for DC planar magnetron sputtering of copper in argon atmosphere. Spatial resolution of the light emission has been achieved by focusing the plasma image ...
High power pulsed magnetron sputtering (HPPMS) is a variant of sputtering deposition method in that pulsed power is applied to the sputtering target with low repetition frequency and small duty ratio. It produces high density plasma intermittently...