藤井 達也   須藤 孝一   生津 資大   井上 尚三   
年次大会 : Mechanical Engineering Congress, Japan 2012 "J032011-1"-"J032011-4" 2012年9月
In this article, the development of mechanical characteristics evaluation technique for FIB-processed nanostructures is described. We designed the on-chip tensile testing device, which consists of a nano-specimen, electrostatic actuator for stretc...